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공정 |
장비명 |
용도 |
Deposition |
Furnace/LPCVD1,2 |
Sio2 산화막 형성 |
Furnace/LPCVD(P) |
산화막/폴리실리콘 |
LPCVD3,4 |
박막(Sio2,SixNx)증착 |
PECVD1 |
박막(Sio2,SixNx)증착 |
PECVD2 |
박막(Sio2,SixNx)증착 |
Parylene packaging sys |
고분자 유기물 증착 |
E-Beam Evaporator |
Metal 박막 증착 |
SG101 Electroform Sys |
Ni 도금 |
Sputter |
다층 금속 증착 |
Etching |
RIE 1 |
박막 식각 |
RIE 2 |
박막 식각 |
Deep Trench RIE(Si) |
Silicon 식각 |
AOE Etcher (Metal) |
Metal식각 |
Oxford Etcher(화합물) |
혼합물 식각 |
XeF2 Etcher |
Silicon 식각 |
Microwave Plasma Asher |
폴리머 제거 |
M-2000 Laser |
Die Saw/Patterning |
Ion milling |
박막식각 |
Inspection |
Micro Scope 1 |
Depth 측정/Inspection |
Micro Scope 2 |
CD측정/Inspection |
Micro Scope 2 |
CD/Depth/Inspection |
Nanospec |
박막두께 측정 |
4-Point Probe |
저항 측정
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Alphastep(ASIQ) |
단차측정 |
E-SEM |
Profile 측정 |
Camscope |
surface Inspection |
Photo Lithography |
E-Beam Lithography |
Nano Pattern 구현/Mask 제작 |
MA6 2 |
Lithography 공정 |
NANOTEC |
Lithography 공정 |
Spin Coater 1(4"용) |
PR Coating |
Spin Coater 2(조각) |
PR Coating |
Spin Dryer/Coater |
PR Coating |
Oven/Hot Plate |
PR Baking |
Hot Plate System |
PR Coating |
Assembly |
Wire Bonder |
Wire Bonding |
Wafer Bonder |
Wafer Bonding |
Wet-Station |
Acid Wet-Station |
Chemical 식각/세정 |
Organic Wet-Station 1 |
Chemical 식각/세정 |
KOH Wet-Station |
Silicon 습식식각 |
Organic Wet-Station 2 |
Chemical 식각/세정 |
Spin Rinse Dryer |
Wafer 건조 |
Ultrasonic |
Chemical 세정 |
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