| |
| ¹øÈ£ |
»çÁø |
Àåºñ¸í |
ºÐ·ù |
Àåºñº¸±â |
¿¹¾à½Åû |
| 32 |
 |
E-SEM |
INSPECTION |
 |
 |
| 31 |
 |
Electroforming Machine |
DEPOSITION |
 |
 |
| 30 |
 |
PECVD II |
DEPOSITION |
 |
 |
| 29 |
 |
LPCVD3 (LTO) |
DEPOSITION |
 |
 |
| 28 |
 |
LPCVD4 (Low Stress Nitride) |
DEPOSITION |
 |
 |
| 27 |
 |
RIE II |
ETCHING |
 |
 |
| 26 |
 |
񃧯Charge |
OTHERS |
 |
 |
| 25 |
 |
FURNACE 2 |
DEPOSITION |
 |
 |
| 24 |
.JPG) |
LPCVD5(Poly) |
DEPOSITION |
 |
 |
| 23 |
 |
Multi Sputter |
DEPOSITION |
 |
 |
| 22 |
 |
°ø°£»ç¿ë·á |
OTHERS |
 |
 |
| 21 |
 |
E-beam Lithography |
PHOTO_LITHOGRAPHY |
 |
 |
| 20 |
 |
wafer Á¦°ø |
OTHERS |
 |
 |
| 19 |
 |
Ion Milling |
ETCHING |
 |
 |
| 18 |
 |
»ç¹°ÇÔ |
OTHERS |
 |
 |
| 17 |
 |
E-Beam Evaporator II |
DEPOSITION |
 |
 |
| 16 |
 |
RIE¥² |
ETCHING |
 |
 |
| 15 |
 |
Spin Coater3 |
PHOTO_LITHOGRAPHY |
 |
 |
| 14 |
 |
½Ã¾à¾ÈÀüº¸°üÇÔ |
OTHERS |
 |
 |
| 13 |
 |
À¯±â½Ã¾àº¸°üÇÔ |
OTHERS |
 |
 |
|