|
¹øÈ£ |
»çÁø |
Àåºñ¸í |
ºÐ·ù |
Àåºñº¸±â |
¿¹¾à½Åû |
31 |
|
E-SEM |
INSPECTION |
|
|
30 |
|
Electroforming Machine |
DEPOSITION |
|
|
29 |
|
PECVD II |
DEPOSITION |
|
|
28 |
|
LPCVD3 (LTO) |
DEPOSITION |
|
|
27 |
|
LPCVD4 (Low Stress Nitride) |
DEPOSITION |
|
|
26 |
|
RIE II |
ETCHING |
|
|
25 |
|
񃧯Charge |
OTHERS |
|
|
24 |
|
FURNACE 2 |
DEPOSITION |
|
|
23 |
|
LPCVD5(Poly) |
DEPOSITION |
|
|
22 |
|
Multi Sputter |
DEPOSITION |
|
|
21 |
|
°ø°£»ç¿ë·á |
OTHERS |
|
|
20 |
|
E-beam Lithography |
PHOTO_LITHOGRAPHY |
|
|
19 |
|
wafer Á¦°ø |
OTHERS |
|
|
18 |
|
Ion Milling |
ETCHING |
|
|
17 |
|
»ç¹°ÇÔ |
OTHERS |
|
|
16 |
|
E-Beam Evaporator II |
DEPOSITION |
|
|
15 |
|
RIE¥² |
ETCHING |
|
|
14 |
|
Spin Coater3 |
PHOTO_LITHOGRAPHY |
|
|
13 |
|
½Ã¾à¾ÈÀüº¸°üÇÔ |
OTHERS |
|
|
12 |
|
À¯±â½Ã¾àº¸°üÇÔ |
OTHERS |
|
|
|